AN815
Vishay Siliconix
Single-Channel LITTLE FOOT R SC-70 6-Pin MOSFET
Copper Leadframe Version
Recommended Pad Pattern and Thermal Performance
INTRODUCTION
EVALUATION BOARDS
SINGLE SC70-6
The new single 6-pin SC-70 package with a copper leadframe
enables improved on-resistance values and enhanced
thermal performance as compared to the existing 3-pin and
6-pin packages with Alloy 42 leadframes. These devices are
intended for small to medium load applications where a
miniaturized package is required. Devices in this package
come in a range of on-resistance values, in n-channel and
p-channel versions. This technical note discusses pin-outs,
package outlines, pad patterns, evaluation board layout, and
thermal performance for the single-channel version.
BASIC PAD PATTERNS
The evaluation board (EVB) measures 0.6 inches by
0.5 inches. The copper pad traces are the same as in Figure 2.
The board allows examination from the outer pins to 6-pin DIP
connections, permitting test sockets to be used in evaluation
testing. See Figure 3.
52 (mil)
6
5
4
See Application Note 826, Recommended Minimum Pad
Patterns With Outline Drawing Access for Vishay Siliconix
MOSFET s, ( http://www.vishay.com/doc?72286 ) for the basic
pad layout and dimensions. These pad patterns are sufficient
for the low to medium power applications for which this
package is intended. Increasing the drain pad pattern yields a
reduction in thermal resistance and is a preferred footprint.
The availability of four drain leads rather than the traditional
single drain lead allows a better thermal path from the package
to the PCB and external environment.
96 (mil)
71 (mil)
13 (mil)
1
0, 0 (mil)
2
3
26 (mil)
18 (mil)
26 (mil)
PIN-OUT
16 (mil)
Figure 1 shows the pin-out description and Pin 1
identification.The pin-out of this device allows the use of four
pins as drain leads, which helps to reduce on-resistance and
junction-to-ambient thermal resistance.
FIGURE 2.
SC-70 (6 leads) Single
D
D
SOT-363
SC-70 (6-LEADS)
1 6
2 5
D
D
The thermal performance of the single 6-pin SC-70 has been
measured on the EVB, comparing both the copper and
Alloy 42 leadframes. This test was first conducted on the
traditional Alloy 42 leadframe and was then repeated using the
1-inch 2 PCB with dual-side copper coating.
G
3
4
S
Top View
FIGURE 1.
For package dimensions see outline drawing SC-70 (6-Leads)
( http://www.vishay.com/doc?71154 )
Document Number: 71334
12-Dec-03
www.vishay.com
1
相关PDF资料
SI1557DH-T1-E3 MOSFET N/P-CH 12V SC70-6
SI1563EDH-T1-GE3 MOSFET N/P-CH 20V SC70-6
SI1900DL-T1-E3 MOSFET N-CH DUAL 30V SC70-6
SI1902DL-T1-GE3 MOSFET N-CH G-S 20V DUAL SC-70-6
SI1926DL-T1-E3 MOSF N CH DUAL D-S 60V SC-70-6
SI1967DH-T1-E3 MOSFET 2P-CH 20V 1.3A SC70-6
SI1970DH-T1-GE3 MOSFET N-CH DUAL 30V SC70-6
SI2300DS-T1-GE3 MOSFET N-CH 30V SOT-23
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